Abstract :
The following topics are dealt with: 3D system integration; TSV interconnects; 3DIC fabrication; 3DIC design; 3D architectures; and 3D stacking of devices.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; three-dimensional integrated circuits; 3D architectures; 3D stacking of devices; 3D systems integration; 3DIC design; 3DIC fabrication; TSV interconnects;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751480
