• DocumentCode
    2970897
  • Title

    Improved glass-ceramic envelope for vacuum interrupters

  • Author

    Parashar, R.S.

  • Author_Institution
    Res. & Technol., ALSTOM Grid, Stafford, UK
  • fYear
    2012
  • fDate
    2-7 Sept. 2012
  • Firstpage
    449
  • Lastpage
    452
  • Abstract
    This study describes an improved hermetic glass-ceramic-to-metal seal which provides a high strength mechanical joint. The new sealing joint reduces electrical stress at the metal interface and is especially suitable for vacuum interrupters designed for high voltage applications requiring high reliability. An improved design of the glass-ceramic-to-metal seal is presented which uses a `U´ section metal end flange. A novel high voltage vacuum interrupter design is presented for a load break switch and fault interrupting applications using fewer components than at present. It has been shown how different features can be incorporated into the glass-ceramic envelopes to avoid the requirement for metallic vapour shields or for external sheds or corrugations to enhance dielectric behaviour. The design could be used directly for an outdoor application eliminating the need for external insulation. Finite element modelling has been used to analyse the seal and interrupter design mechanically and electrically.
  • Keywords
    finite element analysis; flanges; glass ceramics; hermetic seals; reliability; stress analysis; vacuum interrupters; U-section metal end flange; dielectric behaviour; electrical stress reduction; external insulation; fault interrupting applications; finite element modelling; hermetic glass-ceramic-to-metal seal design; high strength mechanical joint; high voltage vacuum interrupter design; improved glass-ceramic envelope; load break switch; metal interface; metallic vapour shields; reliability; Ceramics; Insulators; Interrupters; Joints; Metals; Seals; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
  • Conference_Location
    Tomsk
  • ISSN
    1093-2941
  • Print_ISBN
    978-1-4673-1263-9
  • Electronic_ISBN
    1093-2941
  • Type

    conf

  • DOI
    10.1109/DEIV.2012.6412552
  • Filename
    6412552