Title :
Contacts impact phenomena in a 126 kV vacuum circuit breaker
Author :
Li Yu ; Zhiyuan Liu ; Jianhua Wang ; Yingsan Geng ; Liqiong Sun ; Ranran Yu ; Xiaohui Xue
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
Abstract :
The contacts closing impact phenomenon of vacuum interrupter is a basic event in a vacuum circuit breaker, which reveals lots of information including impact force, bouncing duration, stress distribution and so on. The objective of this paper is to investigate the contacts impact phenomenon in a 126 kV vacuum circuit breakers. PVDF (polyvinyldene fluoride) piezoelectric sensors were used to measure impact force of a 126 kV vacuum circuit breaker at a closing velocity of 1.5 m/s. In addition, a finite element analysis simulation model of contacts impact in a 126 kV vacuum interrupters was set up by using ANSYS / LS-DYNA software. The experimental results showed that the maximum contacts impact force of a 126 kV vacuum circuit breaker was about 105 N at 1.5 m/s closing velocity, which is are in good agreement with the simulation results. And the simulation results also showed that the maximum impact force, durations of contact bounce and the maximum stresses of contact were related with some parameters of vacuum interrupter, such as contact shape, elastic modulus of contact material, impact velocity and contact spring force.
Keywords :
elastic moduli; electrical contacts; finite element analysis; vacuum circuit breakers; vacuum interrupters; ANSYS/LS-DYNA software; PVDF; bouncing duration; contact bounce; contact material; contact shape; contact spring force; contacts impact phenomena; elastic modulus; finite element analysis simulation model; impact force; impact velocity; piezoelectric sensors; polyvinyldene fluoride; stress distribution; vacuum circuit breaker; vacuum interrupter; Circuit breakers; Contacts; Force; Interrupters; Sensors; Steel; Stress;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
Conference_Location :
Tomsk
Print_ISBN :
978-1-4673-1263-9
Electronic_ISBN :
1093-2941
DOI :
10.1109/DEIV.2012.6412558