DocumentCode
2971069
Title
A method of controlling mtc solidification process by cooling threshold
Author
You, Dongdong ; Li, Wenfang ; Shao, Ming ; Li, Yuanyuan
Author_Institution
Sch. of Mech. &s Automotive Eng., South China Univ. of Technol., Guangzhou, China
fYear
2009
fDate
22-24 June 2009
Firstpage
712
Lastpage
715
Abstract
A method of controlling mold temperature control (MTC) solidification process by cooling threshold was presented based on finite element method (FEM) simulation and experiments research. The outcome provides a basis for selecting MTC parameters. The 3D transient heat transfer analysis was done in various conditions which include the cooling threshold of 500, 20, 400, 440, and 300degC respectively. The study results indicated that the cooling thresholds influence the forming process greatly for directly controlling the opening of channels. If the threshold is big beyond the mold preheated temperature, all channels will be opened at the beginning of the process, and the workpiece will be solidified rapidly, but the forming quality is worsened because of the shrinkage cavity. Contrarily, when the threshold is small extremely, cooling channels can´t be opened in time, the forming efficiency will be decreased.
Keywords
cooling; finite element analysis; heat transfer; moulding; process control; shrinkage; solidification; temperature control; transient analysis; 3D transient heat transfer analysis; MTC solidification process control; cooling threshold; finite element method; forming process; mold temperature control; shrinkage cavity; workpiece; Automotive engineering; Computational modeling; Cooling; Heat transfer; Heating; Mathematical model; Process control; Solid modeling; Temperature control; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Information and Automation, 2009. ICIA '09. International Conference on
Conference_Location
Zhuhai, Macau
Print_ISBN
978-1-4244-3607-1
Electronic_ISBN
978-1-4244-3608-8
Type
conf
DOI
10.1109/ICINFA.2009.5205014
Filename
5205014
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