• DocumentCode
    2971069
  • Title

    A method of controlling mtc solidification process by cooling threshold

  • Author

    You, Dongdong ; Li, Wenfang ; Shao, Ming ; Li, Yuanyuan

  • Author_Institution
    Sch. of Mech. &s Automotive Eng., South China Univ. of Technol., Guangzhou, China
  • fYear
    2009
  • fDate
    22-24 June 2009
  • Firstpage
    712
  • Lastpage
    715
  • Abstract
    A method of controlling mold temperature control (MTC) solidification process by cooling threshold was presented based on finite element method (FEM) simulation and experiments research. The outcome provides a basis for selecting MTC parameters. The 3D transient heat transfer analysis was done in various conditions which include the cooling threshold of 500, 20, 400, 440, and 300degC respectively. The study results indicated that the cooling thresholds influence the forming process greatly for directly controlling the opening of channels. If the threshold is big beyond the mold preheated temperature, all channels will be opened at the beginning of the process, and the workpiece will be solidified rapidly, but the forming quality is worsened because of the shrinkage cavity. Contrarily, when the threshold is small extremely, cooling channels can´t be opened in time, the forming efficiency will be decreased.
  • Keywords
    cooling; finite element analysis; heat transfer; moulding; process control; shrinkage; solidification; temperature control; transient analysis; 3D transient heat transfer analysis; MTC solidification process control; cooling threshold; finite element method; forming process; mold temperature control; shrinkage cavity; workpiece; Automotive engineering; Computational modeling; Cooling; Heat transfer; Heating; Mathematical model; Process control; Solid modeling; Temperature control; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information and Automation, 2009. ICIA '09. International Conference on
  • Conference_Location
    Zhuhai, Macau
  • Print_ISBN
    978-1-4244-3607-1
  • Electronic_ISBN
    978-1-4244-3608-8
  • Type

    conf

  • DOI
    10.1109/ICINFA.2009.5205014
  • Filename
    5205014