Author_Institution :
Occidental Chem. Corp., Grand Island, NY, USA
Abstract :
SIM, a new class of soluble, fully imidized polyimidesiloxanes, is discussed. The electronic-grade SIM materials feature an advantageous combination of high tensile strength, Tg(>200°C), thermal stability, flame and chemical resistance with low water absorption, dielectric constant <3.0, and modulus. Various SIM materials are tailor-made for applications such as interlayer dielectrics in multilevel interconnections and for passivation of ICs, encapsulant, adhesives for die attachment and polyimides used in flexible circuit board, and halogen-free jackets for wires and cables. Their performance is compared with that of various commercial polyimides, silicone gels, epoxies, and other high-performance engineering plastics
Keywords :
cable insulation; dielectric materials; encapsulation; flameproofing; integrated circuit technology; organic insulating materials; passivation; polymers; printed circuits; 200 degC; ICs; SIM; adhesives; cables; chemical resistance; die attachment; electronic grade material; encapsulant; flame resistance; flexible circuit board; fully imidized polyimidesiloxanes; halogen-free jackets; high tensile strength; interlayer dielectrics; low dielectric constant; low modulus; low water absorption; multilevel interconnections; passivation; polyimides; soluble polymer; thermal stability; wires; Absorption; Chemicals; Circuit stability; Dielectric materials; Electronics industry; Fires; Polyimides; Polymers; Thermal resistance; Thermal stability;
