Title :
Electrical and tribological properties of copper-based surface alloys formed with a low-energy high-current electron beam
Author :
Yakovlev, E.V. ; Markov, Alexey B. ; Petrov, Vsevolod I.
Author_Institution :
Inst. of High Current Electron., Tomsk, Russia
Abstract :
The electrical and tribological properties of multicomponent surface alloys (stainless steel (SS)-Cu) formed on copper substrate with a low-energy (20-30 keV) high-current (10-30 kA) electron beam (LEHCEB) of microsecond pulse duration (2-4 μm) have been investigated. Formation of surface alloys has been performed using deposition of SS films by means of magnetron sputtering followed by a LEHCEB liquid-phase mixing. A thickness of formed SS-Cu alloys was ranging from 1 to 10 μm. Investigation of properties of copper electrodes with SS-Cu alloy at the surface showed almost three times increase in the electrical strength of vacuum insulation (1 MV/cm) compared with that for initial copper electrodes (0.35 MV/cm). The reached electrical strength of vacuum insulation appear to be close to that for electrodes made of SS. Moreover, scratch tests revealed the significant improving of adhesion of coating to a substrate for surface alloys compared with that for the magnetron deposited coating.
Keywords :
adhesion; copper; electric strength; electrodes; electron beam applications; metallic thin films; sputter deposition; stainless steel; surface alloying; vacuum insulation; wear; FeCCrNiMn-Cu; adhesion; current 10 kA to 30 kA; deposition; electrical properties; electrical strength; electrodes; electron volt energy 20 keV to 30 keV; liquid-phase mixing; low-energy high-current electron beam; magnetron sputtering; multicomponent surface alloys; stainless steel films; tribological properties; vacuum insulation; Copper; Electrodes; Insulation; Steel; Surface topography; Surface treatment;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
Conference_Location :
Tomsk
Print_ISBN :
978-1-4673-1263-9
Electronic_ISBN :
1093-2941
DOI :
10.1109/DEIV.2012.6412583