DocumentCode
2971722
Title
An empirical investigation of RFID adoption and improving process performance in the Manufacturing Supply Chain
Author
Tsai, Wei Chen ; Tang, Ling-Lang
Author_Institution
Dept. of Inf. Manage., Aletheia Univ., Taipei, Taiwan
fYear
2009
fDate
8-11 Dec. 2009
Firstpage
477
Lastpage
481
Abstract
Advances in information technology and the globalization of enterprises are both realities and opportunities of the twenty-first century. This article aims to examine the framework of radio frequency identification technology adoption and improving process performance in the manufacturing supply chain. The research based on IT adoption literatures to explore the related factors of radio frequency identification (RFID) application. In a word, this study differs crucially from previous research, the study (1) addresses interactive firm behaviors in RFID adoption and highlights the value of performance, (2) identifies related constructs of RFID adoption included the industry competition, innovation characteristics as technological complexity and compatibility and cost, and (3) provides research suggestions in RFID adoption behavior and performance focus on efficiency and value for the data collected with 161 manufacturing firms. Thus, we hope the final result is useful to educational circles and practice.
Keywords
production engineering computing; radiofrequency identification; supply chains; RFID adoption; globalization; industry competition; industry innovation; information technology; manufacturing supply chain; process performance improvement; radio frequency identification technology adoption; technological complexity; Costs; Hardware; Information management; Manufacturing industries; Manufacturing processes; RFID tags; Radiofrequency identification; Supply chains; Technological innovation; Virtual manufacturing; Adoption model; Manufacturing Industry; Radio Frequency Identification;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Engineering and Engineering Management, 2009. IEEM 2009. IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-4869-2
Electronic_ISBN
978-1-4244-4870-8
Type
conf
DOI
10.1109/IEEM.2009.5373300
Filename
5373300
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