• DocumentCode
    2972123
  • Title

    Rapid thermal sintering of the metallizations of silicon solar cells

  • Author

    Laugier, A. ; El Omari, H. ; Boyeaux, J.P. ; Hartiti, B. ; Muller, J.C. ; Le Quan Nam ; Sarti, D.

  • Author_Institution
    INSA, CNRS, Villeurbanne, France
  • Volume
    2
  • fYear
    1994
  • fDate
    5-9 Dec 1994
  • Firstpage
    1535
  • Abstract
    Rapid thermal processing (RTP) using radiation from tungsten halogen lamps as a heat source is a very promising candidate to replace conventional furnace annealing as it offers many advantages such as a reduced overall thermal budget and a lower gas consumption. In this paper, the authors show that with moderate temperature, RTP can be used to obtain screen printed contacts with low contacts resistivity and without degrading the transport properties of the solar cell base region. They investigate on Polix multicrystalline solar cells the possibility to replace the conventional sintering by a RTP annealing of the Ag front grid and of the back Al/Ag contact in a single step performed after the antireflection coating deposition
  • Keywords
    electrical contacts; elemental semiconductors; rapid thermal annealing; semiconductor device metallisation; semiconductor device testing; semiconductor-metal boundaries; silicon; sintering; solar cells; RTP annealing; Si; antireflection coating; back contact; base region; contacts resistivity; front grid; metallizations; multicrystalline semiconductor; rapid thermal sintering; screen printed contacts; solar cell; transport properties; Conductivity; Furnaces; Lamps; Metallization; Photovoltaic cells; Rapid thermal annealing; Rapid thermal processing; Silicon; Temperature; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    0-7803-1460-3
  • Type

    conf

  • DOI
    10.1109/WCPEC.1994.520506
  • Filename
    520506