DocumentCode
2972224
Title
A miniaturized 3 × 3-mm SAW antenna duplexer for the US-PCS band with temperature-compensated LiTaO3/sapphire substrate
Author
Tsutsumi, Jun ; Inoue, Shogo ; Iwamoto, Yasuhide ; Miura, Michio ; Matsuda, Takashi ; Satoh, Yoshio ; Nishizawa, Toshio ; Ueda, Masanori ; Ikata, Osamu
Author_Institution
Fujitsu Labs. Ltd., Akashi, Japan
Volume
2
fYear
2004
fDate
23-27 Aug. 2004
Firstpage
954
Abstract
This paper describes a temperature-stable and miniaturized SAW antenna duplexer for the 1.9 GHz US-PCS band that uses a temperature-compensated 42° Y-X:LiTaO3/sapphire bonded substrate. In this duplexer, the temperature coefficient of frequency is reduced to half or two-thirds of that of a conventional LiTaO3 substrate. Also, it is shown that our new duplexer has a smaller insertion loss and offers sufficient power durability. These improvements are mainly due to the characteristics of sapphire, such as its larger thermal conductivity and smaller dielectric constant. Furthermore, the performance of our SAW duplexer is compared with that of two kinds of BAW duplexers, which are competitive technologies. As a result, it is shown that our newly developed SAW duplexer offers equal or better performance in a smaller package. This implies that our SAW duplexer is the best and the smallest PCS duplexer.
Keywords
UHF filters; compensation; lithium compounds; surface acoustic wave filters; 1.9 GHz; 3 mm; LiTaO3-Al2O3; SAW antenna duplexer; SAW filters; UHF filters; US-PCS band duplexer; dielectric constant; insertion loss; sapphire bonded substrate; temperature coefficient of frequency; temperature-compensated substrate; thermal conductivity; Bonding; Dielectric constant; Dielectric substrates; Frequency; Insertion loss; Packaging; Personal communication networks; Surface acoustic waves; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2004 IEEE
ISSN
1051-0117
Print_ISBN
0-7803-8412-1
Type
conf
DOI
10.1109/ULTSYM.2004.1417917
Filename
1417917
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