• DocumentCode
    2973022
  • Title

    Bioinspired, uncooled chitin photomechanical sensor for thermal infrared sensing

  • Author

    Zhang, Nuo ; Cheng, Jim C. ; Warren, Clinton G. ; Pisano, Albert P.

  • Author_Institution
    Berkeley Sensor & Actuator Center, Univ. of California, Berkeley, CA, USA
  • fYear
    2011
  • fDate
    28-31 Oct. 2011
  • Firstpage
    833
  • Lastpage
    836
  • Abstract
    We have designed and fabricated a novel, polymer-ceramic bimorph infrared (IR) sensing element for uncooled operations. The developed sensors utilize biopolymer chitin on ceramic beams, which deflect with changing temperature due to the mismatch in thermal expansion coefficients of the two materials. This is the first known instance of a polysaccharide-based material used in the development of IR sensors. To maximize the bi-material bending effect, a thin layer of chitin is deposited onto a stiff layer of polysilicon. As in nature, chitin makes an ideal absorbing layer for the sensors because of its high thermal expansion coefficient and natural vibrational resonances in the IR range. Experiments using finite element analysis (FEA) simulation showed that the sensitivity of the polymer-ceramic bimorph sensor was 50 times of the sensitivity of the commonly-used metal-ceramic bimorph sensor. The proposed device offers high sensitivity and significant cost savings compared to existing competitive technologies.
  • Keywords
    finite element analysis; infrared detectors; thermal expansion measurement; biopolymer chitin; ceramic beams; chitin photomechanical sensor; finite element analysis; polymer-ceramic bimorph infrared sensing element; polymer-ceramic bimorph sensor; thermal expansion coefficients; thermal infrared sensing; vibrational resonances; Polymers; Sensitivity; Temperature sensors; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2011 IEEE
  • Conference_Location
    Limerick
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-9290-9
  • Type

    conf

  • DOI
    10.1109/ICSENS.2011.6127320
  • Filename
    6127320