Title :
Wafer Level Integrated Antenna Front End Module For Low Cost Phased Array Implementation
Author :
Yang, J.M. ; Chung, Y. ; Nishimoto, M. ; Battung, M. ; Long, A. ; Chang-Chien, P. ; Tornquist, K. ; Siddiqui, M. ; Lai, R.
Author_Institution :
Northrop Grumman Space Technol., Redondo Beach
Abstract :
This paper describes the implementation of a fully integrated antenna front-end that leverages Northrop Grumman Space Technology´s (NGST´s) novel wafer level packaging technique to marry the optimal technology per function through the bonding of III-V wafers. To demonstrate the proposed approach, a 4-element Q-band linear array has been assembled and tested to validate the concept.
Keywords :
III-V semiconductors; antenna phased arrays; integrated circuit testing; linear antenna arrays; millimetre wave antenna arrays; millimetre wave integrated circuits; wafer bonding; wafer level packaging; wafer-scale integration; III-V wafer bonding; Northrop Grumman Space Technology; four-element Q-band linear array; frequency 36 GHz to 46 GHz; phased array implementation; wafer level integrated antenna front end module; wafer level packaging technique; Antenna arrays; Assembly; Costs; III-V semiconductor materials; Linear antenna arrays; Phased arrays; Space technology; Testing; Wafer bonding; Wafer scale integration;
Conference_Titel :
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0688-9
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2007.380138
