Title :
Modeling of Spurious Coupling Between Modes in Metal Packages and Embedded Circuits
Author :
Bolz, T. ; Held, S. ; Neinhus, M. ; Beyer, A. ; Solbach, Klaus
Author_Institution :
IMST GmbH, Kamp-Lintfort
Abstract :
The consideration of electromagnetic interaction between spurious modes in metal packages and its enclosed microwave circuit (MMIC) in a circuit simulator is an important topic in circuit design. In this paper a novel method is described to determine mutual coupling networks for incorporation of this parasitic coupling into a SPICE based circuit simulator. For simple package shapes the coupling networks can be determined analytically, whereas full-wave simulations are needed for more complex ones. To shorten the duration, time-domain simulators need for analyzing a high-Q structure, Prony´s method is applied to extract circuit parameters from short time sequences.
Keywords :
MMIC; SPICE; electromagnetic coupling; MMIC; SPICE based circuit simulator; electromagnetic coupling; metal electronic packages; microwave circuit; spurious coupling; Analytical models; Circuit simulation; Circuit synthesis; Coupling circuits; MMICs; Microwave circuits; Mutual coupling; Packaging; SPICE; Shape; Coupled mode analysis; Coupling circuits; Electromagnetic coupling;
Conference_Titel :
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0687-0
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2007.380187