• DocumentCode
    2974487
  • Title

    Variable frequency microwave induced low temperature dopant activation in ion implanted silicon

  • Author

    Alford, T.L. ; Ahmad, Iftikhar ; Hubbard, Robert

  • Author_Institution
    Sch. of Mech., Chem., & Mater., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2009
  • fDate
    Sept. 29 2009-Oct. 2 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Variable frequency microwave (VFM) anneals are used to activate ion implanted dopants and regrow the damaged silicon at temperatures between 500-550°C. Four-point-probe measurements are used to monitor the extent of dopant activation. Ion channeling analysis reveals that VFM heating removes the Si damage that results from arsenic ion implantation. Transmission electron microscopy demonstrates that the silicon lattice regains nearly all of its crystallinity after microwave processing. Secondary ion mass spectroscopy reveals limited diffusion of dopants in VFM processed samples when compared to a conventional 900°C 30 sec rapid thermal anneal.
  • Keywords
    channelling; elemental semiconductors; ion implantation; secondary ion mass spectroscopy; silicon; transmission electron microscopy; Si; VFM heating; arsenic ion implantation; four-point-probe measurements; ion channeling analysis; ion implanted dopants; ion implanted silicon; microwave processing; rapid thermal anneal; secondary ion mass spectroscopy; silicon lattice; temperature 500 C to 550 C; transmission electron microscopy; variable frequency microwave anneals; variable frequency microwave induced low temperature dopant activation; Annealing; Crystallization; Electromagnetic heating; Frequency; Ion implantation; Lattices; Monitoring; Silicon; Temperature; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Thermal Processing of Semiconductors, 2009. RTP '09. 17th International Conference on
  • Conference_Location
    Albany, NY
  • ISSN
    1944-0251
  • Print_ISBN
    978-1-4244-3814-3
  • Electronic_ISBN
    1944-0251
  • Type

    conf

  • DOI
    10.1109/RTP.2009.5373441
  • Filename
    5373441