• DocumentCode
    2974551
  • Title

    Optimization of THz absorption in thin films

  • Author

    Grbovic, Dragoslav ; Alves, Fabio ; Kearney, Brian ; Apostolos, Karamitros ; Karunasiri, Gamani

  • Author_Institution
    Phys. Dept., Naval Postgrad. Sch., Monterey, CA, USA
  • fYear
    2011
  • fDate
    28-31 Oct. 2011
  • Firstpage
    172
  • Lastpage
    175
  • Abstract
    In this paper, we report on experimentally verified models, which assist in the design and fabrication of either thin metal films, with high broad-band absorption in the 3-5 THz spectral region, or thin metatamaterial structures of nearly 100% absorption at a specific, resonant, THz frequency. The THz absorption properties of the structures were modeled using COMSOL finite element modeling software. Optimized thin metal films and thin metamaterial structures were fabricated using standard microfabrication processes on Si substrates. The THz spectral characteristics of the structures were probed using FTIR spectrometer in the reflection mode. The measured THz reflection, from thin film of both broad-band and resonant metamaterial structures, exhibit excellent agreement with their respective models. Both types of absorbers can be incorporated in the fabrication of MEMS-based THz thermal sensors operating in active mode with quantum cascade laser (QCL) sources.
  • Keywords
    Fourier transform spectra; absorption; finite element analysis; infrared spectra; metallic thin films; metamaterials; microfabrication; microsensors; temperature sensors; COMSOL finite element modeling software; FTIR spectrometer; MEMS-based THz thermal sensors; QCL sources; Si; THz absorption optimization; THz absorption properties; THz reflection; broadband absorption; broadband metamaterial structures; frequency 3 THz to 5 THz; microfabrication processes; optimized thin metal films; quantum cascade laser sources; resonant metamaterial structures; thin metamaterial structures; Absorption; Films; Metamaterials; Quantum cascade lasers; Reflection; Semiconductor device modeling; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2011 IEEE
  • Conference_Location
    Limerick
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-9290-9
  • Type

    conf

  • DOI
    10.1109/ICSENS.2011.6127394
  • Filename
    6127394