Title :
Low Cost Method for Localized Packaging of Temperature Sensitive Capacitive RF MEMS Switches in Liquid Crystal Polymer
Author :
Morton, Matthew A. ; Kingsley, Nickolas ; Papapolymerou, John
Author_Institution :
Georgia Inst. of Technol., Atlanta
Abstract :
This work demonstrates a low cost localized heating packaging method on liquid crystal polymer (LCP) for temperature sensitive devices such as the capacitive RF MEMS switch. Simulations of the heating element structures are performed to examine the thermal characteristics of the bonded regions and switch. Heating lines are fabricated on LCP using the copper cladding, requiring only one photolithography and etch step. The MEMS cavity is formed with two 1 mil layers of low-temp LCP that are etched with a CO2 laser system. The layers are bonded with localized-heating by passing 7 A of DC current through the heating element while compressing the 4 layers together. The bonded switch is submerged in 60degC water for 24 hours to test seal quality. Before and after measurements are shown, providing evidence of a successful bond.
Keywords :
bonding processes; copper; electronics packaging; laser beam etching; liquid crystal polymers; microswitches; photolithography; CO2 laser etching; bonding method; capacitive RF MEMS switches; copper cladding; current 7 A; heating line fabrication; liquid crystal polymer; low-cost localized heating packaging method; photolithography; seal quality; temperature 60 C; temperature-sensitive devices; thermal characteristics; time 24 h; Bonding; Copper; Costs; Etching; Heating; Liquid crystal polymers; Packaging; Radiofrequency microelectromechanical systems; Switches; Temperature sensors; MEMS; Organic; liquid crystal polymer (LCP); packaging; system-on-package;
Conference_Titel :
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0688-9
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2007.380295