Small Form-Factor Integrated Passive Devices for SiP Applications

Author

Liu, Kai ; Frye, Robert C.

Author_Institution

STATS ChipPAC Inc., Tempe

fYear

2007

fDate

3-8 June 2007

Firstpage

2117

Lastpage

2120

Abstract

Higher level of integration has been seen to be the trend of package for wireless communication products. Integration of passive components (e.g. RCL and filters) plays a significant role in the overall size-reduction for system in packaging (SiP) applications. We have developed an integrated passive device (IPD) process using silicon technology to make miniaturized RF components. Advanced design methodology was used to realize fast design cycle-time. Some example IPDs are described in this paper. The manufactured samples have small form-factors and excellent electrical performance. The size of the LPF IPD working at 850 MHz is 1.1 times 0.85 times 0.35 mm³, which is by far the smallest IPD of its kind. The board effect when IPD is in flip-chip configuration was extensively investigated through using HFSS EM simulation and experimental verification. Very good agreement between simulated and measured results validates our design process.

Keywords

flip-chip devices; radiofrequency integrated circuits; system-in-package; HFSS EM simulation; SiP application; flip-chip configuration; frequency 850 MHz; integrated passive device; silicon technology; system in packaging; wireless communication product; Active inductors; Capacitors; Filters; Packaging; Q factor; Radio frequency; Silicon; Substrates; Thin film inductors; Wireless communication; EM simulation; Integrated Passive Device; System in Package; filter; flip-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium, 2007. IEEE/MTT-S International

Conference_Location

Honolulu, HI

ISSN

0149-645X

Print_ISBN

1-4244-0688-9

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2007.380306

Filename

4264288