Effect of various annealing temperature on the morphological and dielectric properties of Polyvinylidenefluoride-Trifluoroethylene thin film

Author

Rozana, M.D. ; Wahid, M.H. ; Arshad, A.N. ; Sarip, M.N. ; Habibah, Z. ; Ismail, L.N. ; Rusop, M. ; Majid, W. H Abd ; Gan, W.C.

Author_Institution

Fac. of Appl. Sci., Univ. Teknol. MARA, Shah Alam, Malaysia

fYear

2012

fDate

24-27 June 2012

Firstpage

749

Lastpage

753

Abstract

The morphology of PVDF-TrFE (70/30) thin film at various annealing temperature were investigated using non-contact mode Atomic Force Microscopy (AFM). Differential Scanning Calorimetry (DSC) technique was used to obtain T_C, T_m, and T_Crys of PVDF-TrFE. The prepared spin coated PVDF-TrFE (70/30) thin films were annealed at T_C (113°C), T_m (154°C), T_Crys (135°C) and T_c at cooling (55°C) in accordance to the DSC thermogram observed. Impedance Spectroscopy were conducted to study the dielectric characteristic of the thin films in order to substantiate the electrical behavior of the thin films From the results obtained, the thin films exhibited different morphologies depending on the annealing temperatures utilized. Formation of needle-like crsytallite structure was observed film annealed at and over T_m. Thin film re-crystallized at T_C has an optimized dielectric constant of ~7.8 at 10⁴ hz.

Keywords

annealing; atomic force microscopy; dielectric thin films; differential scanning calorimetry; electrochemical impedance spectroscopy; permittivity; polymer films; recrystallisation; spin coating; AFM; DSC; annealing; dielectric constant; dielectric properties; differential scanning calorimetry; electrical property; impedance spectroscopy; morphological properties; noncontact mode atomic force microscopy; polyvinylidenefluoride-trifluoroethylene thin films; recrystallization; spin coating; temperature 55 degC to 154 degC; Annealing; Dielectric constant; Films; Heating; Morphology; Plastics; Annealing; Dielectric Constant; Morphology; PVDF-TrFE;

fLanguage

English

Publisher

ieee

Conference_Titel

Humanities, Science and Engineering Research (SHUSER), 2012 IEEE Symposium on

Conference_Location

Kuala Lumpur

Print_ISBN

978-1-4673-1311-7

Type

conf

DOI

10.1109/SHUSER.2012.6268990

Filename

6268990