DocumentCode
2975669
Title
Simulation of wirelessly passive SAW ID-tags/sensors using VHDL-AMS
Author
Fu, Qiuyun ; Fischer, Wolf-Joachim ; Stab, Helmut
Author_Institution
Dept. of Electr. & Inf. Eng., Dresden Univ. of Technol., Germany
Volume
2
fYear
2004
fDate
23-27 Aug. 2004
Firstpage
1541
Abstract
SAW devices can be used in a wide range because of their intriguing properties, such as their ability to store signal energy contained in acoustic waves for a relatively long time, their adaptability to semiconductor producing technology. Since the last decade, SAW scientists have shown great interest in wireless readable identification (ID) tags and sensors. Besides the general properties, SAW ID tags and sensors can work with no battery or wiring, withstand extreme temperatures and work reliably and maintenance-free over decades even in harsh industrial environments. Since the flip-chip technology became applicable to SAW devices, it was proposed to use this technology for bonding SAW devices onto silicon application specific integrated circuits (Si-ASIC). VHDL-AMS (VHSIC hardware description language analog mixed digital) is an extension to VHDL, which was used in ASIC design to support the description and simulation of analog and mixed-signal circuits and systems. Any model valid in VHDL 1076 is valid in VHDL-AMS and yields the same simulation results. In this paper, a method to simulate SAW ID tags/sensors using VHDL-AMS is proposed. We have used the VHDL-AMS simulator (advance ms produced by Mentor Graphics) to simulate SAW ID tags and sensors produced on 128°YX lithium niobate substrates in radio frequency range.
Keywords
application specific integrated circuits; flip-chip devices; hardware description languages; lithium compounds; radiofrequency identification; silicon; simulation; surface acoustic wave sensors; SAW sensors; Si-ASIC; VHDL-AMS; VHSIC hardware description language analog mixed digital; acoustic waves; flip-chip technology; lithium niobate substrates; passive SAW ID-tags; silicon application specific integrated circuits; simulation; wireless readable identification; Acoustic sensors; Acoustic waves; Application specific integrated circuits; Batteries; Circuit simulation; Integrated circuit technology; Surface acoustic wave devices; Surface acoustic waves; Temperature sensors; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2004 IEEE
ISSN
1051-0117
Print_ISBN
0-7803-8412-1
Type
conf
DOI
10.1109/ULTSYM.2004.1418097
Filename
1418097
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