DocumentCode :
2976863
Title :
A 3.8 mm × 3.8 mm × 1.37 mm hermetic FBAR duplexer for 800 MHz handsets with wafer-scale packaging
Author :
Bradley, P. ; Ruby, R. ; Yu, B. ; Grannen, K.
Author_Institution :
Wireless Semicond. Div., Agilent Technol. Inc., San Jose, CA, USA
Volume :
3
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
1694
Abstract :
We describe the design and measured performance of a 3.8 mm × 3.8 mm × 1.37 mm antenna duplexer for the 800 MHz cellular band (Tx: 824-849 MHz, Rx: 869-894 MHz) for cellular handsets based on FBAR (film bulk acoustic resonator) technology. The FBARs are fabricated in a silicon-based IC process technology and are hermetically sealed in a wafer-level packaging process. Two dice, Tx and Rx, are attached to a 4-level printed circuit board, ball-bonded, and encapsulated in plastic to form the final product. Average Tx insertion loss is 1.25 dB, average Rx insertion loss is 1.75 dB. Minimum rejection is 55/45 dB in the Tx/Rx hands, guaranteed isolation is >55/46 dB.
Keywords :
acoustic resonator filters; antenna accessories; bulk acoustic wave devices; cellular radio; network synthesis; wafer-scale integration; 1.25 dB; 1.37 mm; 1.75 dB; 3.8 mm; 4-level printed circuit board; 824 to 849 MHz; 869 to 894 MHz; Si; antenna duplexer; ball-bonding; cellular handsets; film bulk acoustic resonator; hermetic FBAR duplexer; insertion loss; plastic encapsulation; silicon-based IC process technology; wafer-scale packaging; Acoustic measurements; Antenna measurements; Film bulk acoustic resonators; Hermetic seals; Insertion loss; Packaging; Plastics; Printed circuits; Telephone sets; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-8412-1
Type :
conf
DOI :
10.1109/ULTSYM.2004.1418150
Filename :
1418150
Link To Document :
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