Title :
MMIC Compatible Wafer-Level Packaging Technology
Author :
Chang-Chien, P. ; Zeng, X. ; Tornquist, K. ; Nishimoto, M. ; Battung, M. ; Chung, Y. ; Yang, J. ; Farkas, D. ; Yajima, M. ; Cheung, C. ; Luo, K. ; Eaves, D. ; Lee, J. ; Uyeda, J. ; Duan, D. ; Fordham, O. ; Chung, T. ; Sandhu, R. ; Tsai, R.
Author_Institution :
Northrop Grumman Space Technol., Redondo Beach
Abstract :
Northrop Grumman Space Technology (NGST) has developed a MMIC compatible, hermetic wafer-level packaging (WLP) technology that is proven to be hermetic, mechanically and electrically robust. This WLP technology is an enabling technology for realizing lightweight, multifunctional and low cost modules for current and future space and military systems. In this paper, data obtained from various packaged MMICs using NGST´s WLP technology is presented. Furthermore, RF front-end modules with integrated antenna are also demonstrated. NGST´s WLP technology enables true three-dimensional circuit integration by allowing intimate multi-function integration among various MMIC technologies and offers significant size and weight advantages to future high performance RF systems.
Keywords :
MMIC; hermetic seals; wafer level packaging; MMIC compatible wafer-level packaging; NGST; Northrop Grumman Space Technology; RF front-end modules; hermetic packaging; integrated antenna; lightweight multifunctional integration; three-dimensional circuit integration; Costs; Electronics packaging; Fabrication; Integrated circuit technology; MMICs; Radio frequency; Space technology; Temperature; Wafer bonding; Wafer scale integration; Bonding; Heterogeneous Integration; MMIC Packaging; Wafer Scale Assembly; Wafer-Level Packaging;
Conference_Titel :
Indium Phosphide & Related Materials, 2007. IPRM '07. IEEE 19th International Conference on
Conference_Location :
Matsue
Print_ISBN :
1-4244-0875-X
Electronic_ISBN :
1092-8669
DOI :
10.1109/ICIPRM.2007.380677
