• DocumentCode
    2977600
  • Title

    (Cl2:Ar) ICP/RIE Dry Etching of Al(Ga) Sb FOR AlSb/InAs HEMTs

  • Author

    Lefebvre, Eric ; Borg, Malin ; Malmkvist, Mikael ; Grahn, Jan ; Desplanque, Ludovic ; Wallart, Xavier ; Roelens, Yannick ; Dambrine, Gilles ; Cappy, Alain ; Bollaert, Sylvain

  • Author_Institution
    Chalmers Univ. of Technol., Goteborg
  • fYear
    2007
  • fDate
    14-18 May 2007
  • Firstpage
    125
  • Lastpage
    128
  • Abstract
    Dry etching of AlSb and Al0.80Ga0.20Sb has been performed by inductively coupled plasma/reactive ion etching based on a (Cl2:Ar) gas mixture without addition of BCI3. The dry etch process has been used to fabricate AlSb/InAs high electron mobility transistors isolated by a shallow mesa. Good DC/RF results, with extrinsic fT/fmax= 135/105 GHz, have been measured for a 2times50 mum HEMT with a gate length of 295 nm.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; sputter etching; (Cl2:Ar) gas mixture; Al0.80Ga0.20Sb; AlSb; AlSb-InAs; BCI3 addition; HEMT; ICP/RIE dry etching; frequency 105 GHz; frequency 135 GHz; gate length; high electron mobility transistors; inductively coupled plasma etching; reactive ion etching; shallow mesa; Buffer layers; Dry etching; Gold; HEMTs; Indium phosphide; MODFETs; Oxidation; Plasma applications; Plasma measurements; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide & Related Materials, 2007. IPRM '07. IEEE 19th International Conference on
  • Conference_Location
    Matsue
  • ISSN
    1092-8669
  • Print_ISBN
    1-4244-0875-X
  • Electronic_ISBN
    1092-8669
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2007.381139
  • Filename
    4265896