DocumentCode
2977600
Title
(Cl2:Ar) ICP/RIE Dry Etching of Al(Ga) Sb FOR AlSb/InAs HEMTs
Author
Lefebvre, Eric ; Borg, Malin ; Malmkvist, Mikael ; Grahn, Jan ; Desplanque, Ludovic ; Wallart, Xavier ; Roelens, Yannick ; Dambrine, Gilles ; Cappy, Alain ; Bollaert, Sylvain
Author_Institution
Chalmers Univ. of Technol., Goteborg
fYear
2007
fDate
14-18 May 2007
Firstpage
125
Lastpage
128
Abstract
Dry etching of AlSb and Al0.80Ga0.20Sb has been performed by inductively coupled plasma/reactive ion etching based on a (Cl2:Ar) gas mixture without addition of BCI3. The dry etch process has been used to fabricate AlSb/InAs high electron mobility transistors isolated by a shallow mesa. Good DC/RF results, with extrinsic fT/fmax= 135/105 GHz, have been measured for a 2times50 mum HEMT with a gate length of 295 nm.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; sputter etching; (Cl2:Ar) gas mixture; Al0.80Ga0.20Sb; AlSb; AlSb-InAs; BCI3 addition; HEMT; ICP/RIE dry etching; frequency 105 GHz; frequency 135 GHz; gate length; high electron mobility transistors; inductively coupled plasma etching; reactive ion etching; shallow mesa; Buffer layers; Dry etching; Gold; HEMTs; Indium phosphide; MODFETs; Oxidation; Plasma applications; Plasma measurements; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide & Related Materials, 2007. IPRM '07. IEEE 19th International Conference on
Conference_Location
Matsue
ISSN
1092-8669
Print_ISBN
1-4244-0875-X
Electronic_ISBN
1092-8669
Type
conf
DOI
10.1109/ICIPRM.2007.381139
Filename
4265896
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