Title :
Development of antenna-in-package technology for single-chip tri-band radio devices
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
This paper presents my preliminary thoughts on the development of antenna-in-package (AiP) technology for single-chip tri-band radio devices operating in the 2.4, 5, and 60 GHz bands based on microstrip patch antennas by exploring the novel patch-by-patch and patch-in-patch schemes. It is found that impedance bandwidth is not wide enough to cover the whole 60 GHz band. Thus, either bandwidth enhancement needs to be done or choice of other antenna types should be made in the next-step development.
Keywords :
UHF antennas; electronics packaging; microstrip antennas; millimetre wave antennas; multifrequency antennas; antenna-in-package technology; bandwidth enhancement; frequency 2.4 GHz; frequency 5 GHz; frequency 60 GHz; microstrip patch antennas; single-chip triband radio devices; Ceramics; Dual band; Microstrip; Microstrip antennas; Patch antennas;
Conference_Titel :
Antenna Technology (iWAT), 2011 International Workshop on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-9133-9
DOI :
10.1109/IWAT.2011.5752287
