DocumentCode
2978121
Title
Low Residual Stress and High Repeatability of SiNX Thin Films for InP-based Optoelectronic Device Fabrication by Dual Radio Frequency Plasma Enhanced Chemical Vapor Deposition
Author
Song, Yu ; Xiong, Bing ; Sun, Changzheng ; Luo, Yi
Author_Institution
Tsinghua Univ., Beijing
fYear
2007
fDate
14-18 May 2007
Firstpage
233
Lastpage
236
Abstract
Low residual stress and high repeatability of plasma enhanced chemical vapor deposited SiNx thin films were obtained by optimizing dual radio frequency power source and eliminating influence of dielectric films formerly deposited on chamber wall.
Keywords
III-V semiconductors; dielectric thin films; indium compounds; internal stresses; optoelectronic devices; plasma CVD coatings; semiconductor thin films; silicon compounds; wide band gap semiconductors; PECVD; chamber wall; dielectric films; dual radio frequency plasma enhanced chemical vapor deposition; high-repeatability thin films; optoelectronic device fabrication; plasma enhanced chemical vapor deposition; residual stress; Chemical vapor deposition; Dielectric thin films; Optical device fabrication; Optoelectronic devices; Plasma chemistry; Plasma devices; Radio frequency; Residual stresses; Sputtering; Thin film devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide & Related Materials, 2007. IPRM '07. IEEE 19th International Conference on
Conference_Location
Matsue
ISSN
1092-8669
Print_ISBN
1-4244-0875-X
Electronic_ISBN
1092-8669
Type
conf
DOI
10.1109/ICIPRM.2007.381166
Filename
4265923
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