• DocumentCode
    2978328
  • Title

    High performance piezoelectric films for high frequency MEMS ultrasonic transducers

  • Author

    Zhang, Q.Q. ; Djuth, F.T. ; Zhou, Q.F. ; Shung, K.K.

  • Author_Institution
    Geospace Res., Inc., El Segundo, CA, USA
  • Volume
    3
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    1954
  • Abstract
    (1-x)PbYb12/Nb12/Nb12/O3-xPbTiO3 (PYbN-PT, x=0.5) thin films were investigated for high frequency transducer applications in this work. Firstly, highly [001] oriented LaNiO3 (LNO) thin films were prepared on Si [001] substrates by a simple metal organic decomposition technique. The room temperature resistivity of the LNO thin films was 0.65 mΩ·cm. Then PYbN-PT thin films were deposited onto the LNO/Si substrates by sol-gel processing. X-ray diffraction analysis revealed that the films of PYbN-PT were highly [001] oriented along the LNO/Si substrates. The films had a uniform grain size of about 80-120 nm. At 1 kHz, the dielectric permittivity was 920, and dielectric loss is about 0.035. The ferroelectric films displayed good P-E hysteresis characteristics and better temperature stabilization compared with films that have lower Curie temperature. Finally, following PiezoCAD modeling, the PYbN-PT film high frequency transducer was designed.
  • Keywords
    X-ray diffraction; ferroelectric thin films; lanthanum compounds; micromechanical devices; piezoelectric thin films; silicon; sol-gel processing; ultrasonic transducers; 1 kHz; LNO thin films; LaNiO3; P-E hysteresis; PYbN-PT; PiezoCAD modeling; Si; Si substrates; X-ray diffraction analysis; ferroelectric films; high frequency MEMS; high performance piezoelectric films; metal organic decomposition; room temperature resistivity; sol-gel processing; temperature stabilization; thin films; ultrasonic transducers; Dielectric losses; Dielectric substrates; Ferroelectric films; Frequency; Micromechanical devices; Niobium; Piezoelectric films; Semiconductor thin films; Temperature; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1418215
  • Filename
    1418215