DocumentCode :
2979760
Title :
Efficient mixed-domain analysis of electrostatic MEMS
Author :
Li, Gang ; Aluru, N.R.
Author_Institution :
Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
fYear :
2002
fDate :
10-14 Nov. 2002
Firstpage :
474
Lastpage :
477
Abstract :
We present efficient computational methods for scattered point and meshless analysis of electrostatic microelectromechanical systems (MEMS). Electrostatic MEMS are governed by coupled mechanical and electrostatic energy domains. A self-consistent analysis of electrostatic MEMS is implemented by combining a finite cloud method based interior mechanical analysis with a boundary cloud method based exterior electrostatic analysis. Lagrangian descriptions are used for both mechanical and electrostatic analyses. Meshless finite cloud and boundary cloud methods combined with fast algorithms and Lagrangian descriptions are flexible, efficient and attractive alternatives compared to conventional finite element/boundary element methods for self-consistent electromechanical analysis. Numerical results are presented for an electrostatic comb drive device.
Keywords :
electrostatic devices; micromechanical devices; numerical analysis; semiconductor device models; Lagrangian descriptions; boundary cloud method based exterior electrostatic analysis; coupled mechanical/electrostatic energy domains; efficient computational methods; electrostatic MEMS; electrostatic comb drive device; electrostatic microelectromechanical systems; fast algorithms; finite cloud method based interior mechanical analysis; finite element/boundary element methods; meshless methods; mixed-domain analysis; scattered point meshless analysis; self-consistent analysis; self-consistent electromechanical analysis; Algorithm design and analysis; Clouds; Conductors; Couplings; Electrostatic analysis; Finite element methods; Lagrangian functions; Magnetic analysis; Micromechanical devices; Performance analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Aided Design, 2002. ICCAD 2002. IEEE/ACM International Conference on
ISSN :
1092-3152
Print_ISBN :
0-7803-7607-2
Type :
conf
DOI :
10.1109/ICCAD.2002.1167574
Filename :
1167574
Link To Document :
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