DocumentCode :
2979818
Title :
Semiconductor Foundry Partnership
Author :
Sun, Shih-Wei
Author_Institution :
United Microelectron. Corp, Hsinchu
fYear :
2007
fDate :
20-22 Dec. 2007
Firstpage :
13
Lastpage :
13
Abstract :
Summary form only given. The proliferation of system-on-chip (SoC) design has created a whole new market of smart products that have decreased in size while greatly increasing in functionality. However, new challenges have made it more difficult for designers to achieve first-time-right silicon success in time to meet market windows. For designers to be successful, a comprehensive SoC solution package that covers the entire chip development is needed. UMC collaborates closely with customers as well as partners throughout the entire supply chain, including equipment, EDA tool, IP vendors, and memory partners to work synergistically towards each customer´s SoC silicon success. This has resulted in a broad range of resources available to SoC designers, including silicon validated reference flows, broad IP portfolio, libraries, embedded memory macros, and cost effective prototyping. We also understand system implications so that we can engage in productive dialogue and offer suggestions to optimize system partition for each SoC design. Combining the aforementioned efforts with UMC advanced 90/80nm, 65/55nm, 45/40nm, 32nm and below process technologies, extensive package and test capabilities, and state-of-the-art 300mm manufacturing, the result is the complete UMC SoC foundry solution to deliver successful results in a timely fashion.
Keywords :
integrated circuit design; semiconductor device manufacture; silicon; system-on-chip; EDA tool; IP vendors; UMC; memory partners; semiconductor foundry partnership; silicon; supply chain; system-on-chip design; Chip scale packaging; Collaborative tools; Collaborative work; Electronic design automation and methodology; Foundries; Packaging machines; Portfolios; Silicon; Supply chains; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
Conference_Location :
Tainan
Print_ISBN :
978-1-4244-0637-1
Electronic_ISBN :
978-1-4244-0637-1
Type :
conf
DOI :
10.1109/EDSSC.2007.4450049
Filename :
4450049
Link To Document :
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