D2BGA chip-scale IGBT package

We present a chip-scale IGBT package, termed die dimensional ball grid array (D²BGA), which uses solder joints to interconnect power chips. D²BGA package consists of a power chip, inner solder caps, high-lead solder balls, and molding resin. It has the same lateral dimensions as the starting power chip, which makes high-density packaging and module miniature possible. This package enables the power chip to combine excellent thermal transfer, high current handling capability, improved electrical characteristics, and ultra-low profile packaging. Electrical tests show that the V_CE(sat) of the D ²BGA high speed IGBTs are improved by 20% to 30% by eliminating the device´s wirebonds and other external interconnections, such as leadframe. In this paper, we present the design and fabrication process of D²BGA package, and the application of these D²BGA package in building three-dimensional integrated power electronics modules (IPEMs). The electrical and temperature cycling test results of the packaged devices and the power modules are reported