Title :
Increased lifetime of wire bonding connections for IGBT power modules
Author :
Hamidi, A. ; Kaufmann, S. ; Herr, E.
Author_Institution :
ABB Corp. Res. ltd., Baden-Dattwil, Switzerland
Abstract :
In power transmission, industrial and traction applications IGBT modules are required to reach a high lifetime while operating under severe working conditions and in harsh environments. Therefore, ABB is taking care of reliability and lifetime requirements at the early stages of the modules´ packaging design and development. This paper deals with the wire bonding interconnection technology used in power IGBT modules and the specific failures related to thermal fatigue phenomena. A technology comparison is performed for wire bonding: with and without a polymer bond coating as well as bonding on strain buffer. The potential of these different technologies to enhance reliability and lifetime is assessed
Keywords :
insulated gate bipolar transistors; interconnections; lead bonding; multichip modules; reliability; semiconductor device packaging; thermal analysis; thermal stress cracking; IGBT modules; IGBT power modules; harsh environments; high lifetime; lifetime improvement; lifetime requirements; multichip modules; packaging design; polymer bond coating; power IGBT modules; power transmission; reliability; severe working conditions; strain buffer bonding; thermal fatigue phenomena; wire bonding; wire bonding connections; wire bonding interconnection technology; Bonding; Capacitive sensors; Coatings; Employee welfare; Fatigue; Insulated gate bipolar transistors; Packaging; Polymer films; Power transmission; Wire;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2001. APEC 2001. Sixteenth Annual IEEE
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-6618-2
DOI :
10.1109/APEC.2001.912494
