• DocumentCode
    2980385
  • Title

    Fabrication of Vertically Aligned Silicon Nanowire Arrays and Investigation on the Formation of the Nickel Silicide Nanowires

  • Author

    Cheng, S.L. ; Chung, C.H. ; Lee, H.C.

  • Author_Institution
    Nat. Central Univ., Chungli
  • fYear
    2007
  • fDate
    20-22 Dec. 2007
  • Firstpage
    121
  • Lastpage
    124
  • Abstract
    Large-area, vertically aligned silicon nanowire arrays have been successfully fabricated on (001)Si substrates via the redox reactions between silicon and silver ions in the aqueous solution of AgNO3/HF. From SEM and TEM observations, the typical widths of the synthesized SiNWs are in the range of 30-200 nm. The lengths of SiNWs could be tuned from several to tens of micrometers by adjusting the reaction temperatures and time. For the Ni thin films on Si nanowires samples, the growth of epitaxial NiSi2 was found to be more favorable for the samples with smaller nanowire widths. The epitaxial orientation relationship between the NiSi2 and Si nanowires was identified to be [100]NiSi2// [100]Si and (002)NiSi2//(004)Si. The observed results present the exciting prospect that with appropriate controls, this approach could be applied to investigate the phase transformation and growth kinetics of other metal contacts or interconnects on Si substrates at the nanometer-scale.
  • Keywords
    nanowires; nickel compounds; oxidation; phase transformations; reduction (chemical); scanning electron microscopy; silicon; transmission electron microscopy; NiSi2; SEM; Si; TEM; growth kinetics; nickel silicide nanowires; phase transformation; redox reactions; size 30 nm to 200 nm; vertically aligned silicon nanowire arrays; Fabrication; Hafnium; Kinetic theory; Nickel; Semiconductor thin films; Silicides; Silicon; Silver; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
  • Conference_Location
    Tainan
  • Print_ISBN
    978-1-4244-0637-1
  • Electronic_ISBN
    978-1-4244-0637-1
  • Type

    conf

  • DOI
    10.1109/EDSSC.2007.4450077
  • Filename
    4450077