• DocumentCode
    2981087
  • Title

    A Simulation Study of Oxide Thickness Effect on the Performance of SiGe HBTs with SOI Structure

  • Author

    Liao, S.H. ; Wang, W.C. ; Chang, S.T. ; Lin, C.Y.

  • Author_Institution
    Nat. Chung Hsing Univ., Taichung
  • fYear
    2007
  • fDate
    20-22 Dec. 2007
  • Firstpage
    271
  • Lastpage
    274
  • Abstract
    Using a TCAD simulator, we examine the oxide thickness effect on electrical characteristics of the SiGe HBT on SOI substrates. We have investigated this effect on Early voltage, cut-off frequency, and maximum oscillation frequency for SiGe HBT on SOI substrate. It is found that the maximum oscillation frequency (fmax) of SiGe HBT on SOI substrate is much better than that of conventional SiGe HBT. The maximum oscillation frequency increases with the increase in oxide thickness and tend to saturate at oxide thickness of 0.15 mum. In order to study oxide thickness on self-heating effect, thermal resistances are also simulated.
  • Keywords
    Ge-Si alloys; heterojunction bipolar transistors; silicon-on-insulator; technology CAD (electronics); SOI substrate; SiGe; SiGe HBT; TCAD simulator; cut-off frequency; early voltage; maximum oscillation frequency; oxide thickness effect; thermal resistance; Circuit simulation; Computational modeling; Cutoff frequency; Doping; Electric variables; Germanium silicon alloys; Heterojunction bipolar transistors; Silicon germanium; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
  • Conference_Location
    Tainan
  • Print_ISBN
    978-1-4244-0637-1
  • Electronic_ISBN
    978-1-4244-0637-1
  • Type

    conf

  • DOI
    10.1109/EDSSC.2007.4450114
  • Filename
    4450114