DocumentCode
2981926
Title
Scaling, Power, and the Future of CMOS Technology
Author
Horowitz, Mark
Author_Institution
Room 306, Gates Computer Science Building, 353 Serra Mall, Stanford, CA 94305, Ph: (650)725-3707, FAX: (650)725-6949, Email: horowitz@ee.stanford.edu
fYear
2008
fDate
23-25 June 2008
Firstpage
7
Lastpage
8
Abstract
Over 40 years ago, Gordon Moore wrote a short paper that has come to define this industry. In addition to the prediction that IC device counts would grow exponentially, this paper also described three main challenges to scaling: power, design cost, and what to do with the available functionality. While we have found good uses for the added functionality, power and design cost remain critical issues today, and with the ending of Dennard scaling, power looms as the largest challenge in our ability to continue to scale computing performance. This talk looks briefly at the origins of this power crisis, and then explores architectural and circuit approaches to produce energy efficient designs. The results have some interesting implications for device design.
Keywords
CMOS integrated circuits; integrated circuit design; CMOS scaling; CMOS technology; energy efficient design; high power chips; Bipolar integrated circuits; CMOS integrated circuits; CMOS technology; Computer industry; Computer science; Cost function; Dynamic voltage scaling; Energy efficiency; MOS devices; Paper technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference, 2008
Conference_Location
Santa Barbara, CA
ISSN
1548-3770
Print_ISBN
978-1-4244-1942-5
Electronic_ISBN
1548-3770
Type
conf
DOI
10.1109/DRC.2008.4800711
Filename
4800711
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