A fully-integrated single-chip SOC for Bluetooth

Author

Eynde, F.O. ; Schmit, J.-J. ; Charlier, V. ; Alexandre, R. ; Sturman, C. ; Coffin, K. ; Mollekens, B. ; Craninckx, J. ; Terrijn, S. ; Monterastelli, A. ; Beerens, S. ; Goetschalckx, P. ; Ingels, M. ; Joos, D. ; Guncer, S. ; Pontioglu, A.

Author_Institution

Alcatel Microelectron., Zaventem, Belgium

fYear

2001

fDate

7-7 Feb. 2001

Firstpage

196

Lastpage

197

Abstract

A 0.25 /spl mu/m CMOS IC contains all analog and digital electronics required for a point-to-multipoint Bluetooth node. The circuit includes RF front-end and digital baseband processor, microprocessor and flash memory with software stack. The 41 mm/sup 2/ die has 15 dB noise figure and 2 dBm maximum transmitter output, and consumes 125 mW at 2.5 V during receive.

Keywords

CMOS digital integrated circuits; application specific integrated circuits; flash memories; integrated circuit noise; wireless LAN; 0.25 micron; 125 mW; 15 dB; 2.5 V; CMOS; RF front-end; digital baseband processor; flash memory; maximum transmitter output; noise figure; point-to-multipoint Bluetooth node; single-chip SOC; software stack; Analog integrated circuits; Baseband; Bluetooth; CMOS analog integrated circuits; CMOS digital integrated circuits; CMOS integrated circuits; Flash memory; Microprocessors; Noise figure; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International

Conference_Location

San Francisco, CA, USA

ISSN

0193-6530

Print_ISBN

0-7803-6608-5

Type

conf

DOI

10.1109/ISSCC.2001.912601

Filename

912601