• DocumentCode
    2982280
  • Title

    Scan-architecture-based evaluation technique of SET and SEU soft-error rates at each flip-flop in logic VLSI systems

  • Author

    Yanagawa, Y. ; Kobayashi, D. ; Ikeda, H. ; Saito, H. ; Hirose, K.

  • Author_Institution
    Dept. of Electron. Eng., Univ. of Tokyo, Tokyo, Japan
  • fYear
    2007
  • fDate
    10-14 Sept. 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A scan flip-flop (FF) is designed to observe both single event transient (SET) and single event upset (SEU) soft errors in logic VLSI systems. The SET and SEL´ soft errors mean the upset caused by latching an SET pulse that originates in combinational logic blocks and the upset caused by a direct ion hit to the FF, respectively. An irradiation test method using the scan FF is proposed to obtain SET and SEL soft-error rates at each FF distributed in logic VLSI systems. A test chip is designed using a 0.2-mum fully-depleted silicon-on-insnlator standard cell library. The basic concepts have been validated with Verilog timing simulations. The cell-level implementation costs of the proposed scan FF are estimated to be reasonable.
  • Keywords
    VLSI; flip-flops; logic testing; silicon-on-insulator; SEU soft-error rates; Verilog timing simulation; cell-level implementation costs; flip-flop; fully-depleted silicon-on-insnlator standard cell library; irradiation test method; logic VLSI system; scan-architecture-based evaluation technique; single event transient soft error rate; single event upset soft error rate; size 0.2 mum; test chip; Costs; Flip-flops; Hardware design languages; Libraries; Logic design; Logic testing; Single event upset; System testing; Timing; Very large scale integration; Single event upset; integrated circuit radiation effects; irradiation test; logic VLSI system; scan architecture; single event transient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation and Its Effects on Components and Systems, 2007. RADECS 2007. 9th European Conference on
  • Conference_Location
    Deauville
  • ISSN
    0379-6566
  • Print_ISBN
    978-1-4244-1704-9
  • Type

    conf

  • DOI
    10.1109/RADECS.2007.5205569
  • Filename
    5205569