Title :
The Effect of Mobility Enhanced Technology on Device Characteristic and Reliability for sub-90nm SOI nMOSFETs
Author :
Hsu, Chia-Wei ; Yeh, Wen-Kuan ; Lai, Chieh-Ming ; Lin, Chien-Ting ; Fang, Yean-Kuen
Author_Institution :
Nat. Univ. of Kaohsiung, Kaohsiung
Abstract :
For SOI nMOSFET, the impact of high tensile stress contact etching stop (CESL) SiN layer on device performance and reliability were investigated. In this work, device driving capability can be enhanced with thicker CESL layer, larger LOD and narrower gate width. With electrical and body potential inspection, larger STI-induced edge current was found especially in narrow gate device.
Keywords :
MOSFET; etching; inspection; nitrogen compounds; semiconductor device reliability; silicon compounds; silicon-on-insulator; stress effects; tensile strength; SiN; body potential inspection; contact etching stop; device characteristic; device reliability; edge current; electrical inspection; mobility enhanced technology; nMOSFET; narrow gate device; silicon-on-insulator; tensile stress; Compressive stress; Contacts; Degradation; Etching; Hot carriers; MOSFETs; Microelectronics; Silicon compounds; Tensile stress; Voltage;
Conference_Titel :
Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
Conference_Location :
Tainan
Print_ISBN :
978-1-4244-0637-1
Electronic_ISBN :
978-1-4244-0637-1
DOI :
10.1109/EDSSC.2007.4450186
