DocumentCode :
2982576
Title :
Can the Interband Tunnel FET Outperform Si CMOS?
Author :
Zhang, Qin ; Seabaugh, Alan
Author_Institution :
Dept. of Electr. Eng., Univ. of Notre Dame, Notre Dame, IN
fYear :
2008
fDate :
23-25 June 2008
Firstpage :
73
Lastpage :
74
Abstract :
This paper presents simulations on tunnel field-effect transistors (TFET) and comparisons carefully to assess their impact at the same supply voltage. Current-voltage characteristics are simulated for n and p TFETs with different channel materials:Si,Ge,InGaAs, and InAs. Results show that InAs has the highest current for its smallest bandgap and effective mass, but it can not meet the off-state leakage requirement for the significant thermal emission across its narrow bandgap; Ge and InGaAs have high channel currents at 0.5 V and have much lower off-state current than MOSFETs due to their higher off-state thermal barrier between source and drain. The speed, power and energy comparisons at 0.5 V supply voltage of n-TFETs with different channel materials and scaled NMOS are also examined. The p-TFET compares even more favorably with the pMOSFET, having higher speed. TFETs with proper channel material have the potential for high-performance relative to Si at the same supply voltage.
Keywords :
III-V semiconductors; MOSFET; effective mass; elemental semiconductors; energy gap; gallium arsenide; germanium; indium compounds; silicon; tunnel transistors; CMOS; TFETs; bandgap; channel material; current-voltage characteristics; effective mass; interband tunnel FET; off-state leakage; off-state thermal barrier; pMOSFET; scaled NMOS; supply voltage; thermal emission; tunnel field-effect transistors; voltage 0.5 V; CMOS technology; Effective mass; FETs; Indium gallium arsenide; MOS devices; MOSFETs; Photonic band gap; Solid modeling; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2008
Conference_Location :
Santa Barbara, CA
ISSN :
1548-3770
Print_ISBN :
978-1-4244-1942-5
Electronic_ISBN :
1548-3770
Type :
conf
DOI :
10.1109/DRC.2008.4800740
Filename :
4800740
Link To Document :
بازگشت