Title :
Materials, environment, motion, and electrical contact failure mechanisms
Author_Institution :
Battelle-Columbus, OH, USA
Abstract :
Surface films produced by natural aging mechanisms are primarily responsible for the failure of electrical contacts in the field. Some of the mechanisms of organic and inorganic film formation are reviewed. It is demonstrated that the sudden failure mode is entirely consistent with contemporary theories of film effects and asperity models of the contact interface. Reliability of the electrical contact is shown to be a function of materials, the operating environment, and interface motion. On the basis of the present understanding of film formation kinetics and typical asperity sizes, it is concluded that interfaces do not degrade by a simple asperity erosion process. However, film formation occurs in areas surrounding asperity peaks due to environmental ingress. It is proposed that this source of film, together with microscopic movement of the interface, can account for a major portion of the intermittent and hard contact failures related to surface films. These results strongly indicate that the disturbance/motion effects must be incorporated into laboratory qualification procedures. If they are not, typical results may grossly underestimate probable contact performance
Keywords :
ageing; electrical contacts; environmental testing; failure analysis; materials testing; reliability; areas surrounding asperity peaks; asperity models; asperity sizes; contact environment; contact interface; contact materials; contact motion; electrical contact failure mechanisms; environmental ingress; failure in the field; failure of electrical contacts; film formation kinetics; hard contact failures; inorganic film formation; interface motion; laboratory qualification procedures; microscopic movement; motion effects; natural aging mechanisms; operating environment; organic film formation; source of film; sudden failure mode; surface films; theories of film effects; Aging; Conductive films; Contact resistance; Corrosion; Discrete event simulation; Electric breakdown; Failure analysis; Laboratories; Qualifications; Surface resistance;
Conference_Titel :
Electrical Contacts, 1989., Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on
Conference_Location :
Chicago, IL
DOI :
10.1109/HOLM.1989.77913