Title :
3-D assembly interposer technology for next-generation integrated systems
Author :
Ohsawa, K. ; Odaira, H. ; Ohsawa, M. ; Hirade, S. ; Lijima, T. ; Pierce, S.G.
Author_Institution :
North Corp., Tokyo, Japan
Abstract :
Interposers are responsible for 40% of total packaging costs, excluding measurement and testing. With two-layer wiring, this ratio rises to 70%. This interposer uses a simple, two-metal process for low cost. The article shows a sub-materials cost comparison between this interposer and a conventional 2-metal interposer. With this interposer, cost savings are 50%. This is done by eliminating costly laser drilling, via metalization, and ball mounting processes, replacing high-priced photosensitive polyimide with an inexpensive insulator, and by this production system.
Keywords :
integrated circuit metallisation; integrated circuit packaging; microassembling; wiring; 3D assembly interposer technology; ball mounting processes; laser drilling; next-generation integrated systems; production system; sub-materials cost comparison; total packaging costs; two-layer wiring; two-metal process; via metalization; Assembly; Costs; Drilling; Insulation; Metal-insulator structures; Packaging; Polyimides; Production systems; Testing; Wiring;
Conference_Titel :
Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-6608-5
DOI :
10.1109/ISSCC.2001.912634
