Title :
Scaling of High-Performance InAs/AlSb/GaSb Heterostructure Detectors for Millimeter-Wave and Submillimeter-Wave Sensing and Imaging
Author :
Su, Ning ; Zhang, Z. ; Rajavel, R. ; Deelman, P. ; Schulman, J.N. ; Fay, P.
Abstract :
The state of the art in millimeter-wave detection and imaging using Sb-heterostructure detectors has been advanced recently with demonstration of excellent low-noise performance through the use of very thin (< 15 Aring) tunnel barriers. This reduction in tunnel barrier thickness improves the noise by reducing the thermal noise associated with the junction resistance, Rj. However, the thinner barrier also increases the junction capacitance, Cj, and the decreased Rj and increased Cj degrade the detector´s sensitivity, betav, and frequency response. In this work, the combined effects of scaling the tunnel barrier thickness and device area have been studied experimentally and modeled, allowing optimization of the device performance for both low noise and high cut-off frequency for millimeter-wave and sub-millimeter-wave sensing and imaging.
Keywords :
III-V semiconductors; aluminium compounds; capacitance; electrical resistivity; frequency response; gallium compounds; indium compounds; millimetre wave detectors; millimetre wave imaging; semiconductor heterojunctions; submillimetre wave detectors; submillimetre wave imaging; tunnel diodes; InAs-AlSb-GaSb; Poisson-Schrodinger solver; Sb-heterostructure tunnel diodes; capacitance; cut-off frequency; epitaxial structures; frequency 1 GHz to 50 GHz; frequency response; high-performance heterostructure detectors; millimeter-wave imaging; millimeter-wave sensing; on-wafer bias-dependent s-parameter measurements; scalable harmonic balance model; series resistance; size 10 A; size 32 A; submillimeter-wave imaging; submillimeter-wave sensing; tunnel barrier thickness; Acoustical engineering; Area measurement; Capacitance; Cutoff frequency; Detectors; Electrical resistance measurement; Frequency response; Noise reduction; Semiconductor device noise; Thermal resistance;
Conference_Titel :
Device Research Conference, 2008
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-4244-1942-5
Electronic_ISBN :
1548-3770
DOI :
10.1109/DRC.2008.4800765