DocumentCode :
2983140
Title :
A 285 mW CMOS single chip analog front end for G.SHDSL
Author :
Laaser, P. ; Eichler, T. ; Wenske, H. ; Herbison, D. ; Eichfeld, H.
Author_Institution :
Infineon Technol. AG, Munich, Germany
fYear :
2001
fDate :
7-7 Feb. 2001
Firstpage :
298
Lastpage :
299
Abstract :
The Single-Pair High-Speed Digital Subscriber Line (G.SHDSL) standard defines full duplex transmission on a single copper loop with variable data rates between 192kb/s and 2.3Mb/s. The achievable loop length varies between 6.3kft and 19.81kft (American Standard), depending on the selected data rate. G.SHDSL uses a trellis-coded PAM-modulation scheme with echo compensation for bandwidth-efficient data transmission in the baseband. A flat symmetrical spectral power density up to 384kHz with a transmit power of 13.5dBm (14.5dBm in Europe above 2.048Mb/s) guarantees spectral compatibility with existing xDSL services. The system concept presented here, together with 3.2 peak-to-rms ratio of the transmit signal, provide the basis for a low power single-chip implementation of the analog front end.
Keywords :
CMOS analogue integrated circuits; digital subscriber lines; echo suppression; low-power electronics; pulse amplitude modulation; trellis coded modulation; 192 kbit/s to 2.3 Mbit/s; 285 mW; 384 kHz; CMOS single chip analog front end; G.SHDSL; achievable loop length; bandwidth-efficient data transmission; echo compensation; flat symmetrical spectral power density; full duplex transmission; low power single-chip implementation; peak-to-rms ratio; selected data rate; single-pair high-speed digital subscriber line; spectral compatibility; transmit power; transmit signal; trellis-coded PAM-modulation scheme; variable data rates; xDSL services; Attenuation; Band pass filters; CMOS technology; Copper; Driver circuits; Electronics packaging; Frequency; Impedance; Noise level; Resistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International
Conference_Location :
San Francisco, CA, USA
ISSN :
0193-6530
Print_ISBN :
0-7803-6608-5
Type :
conf
DOI :
10.1109/ISSCC.2001.912645
Filename :
912645
Link To Document :
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