• DocumentCode
    2983270
  • Title

    A MEMS-based quartz resonator technology for GHz applications

  • Author

    Stratton, Frederic P. ; Chang, David T. ; Kirby, Deborah J. ; Joyce, Richard J. ; Hsu, Tsung-Yuan ; Kubena, Randall L. ; Yong, Yook-Kong

  • Author_Institution
    Sensors & Mater. Lab., Hughes Res. Labs., Malibu, CA, USA
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    27
  • Lastpage
    34
  • Abstract
    We report on the development of a new MEMS quartz resonator technology that allows for the processing and integration of VHF to UHF high-Q oscillators and filters with high-speed silicon or III-V electronics. The paper describes the successful demonstration of new wafer bonding and dry plasma etching processes that make quartz-MEMS technology possible. We present impedance, Q, and temperature sensitivity data along with comparison to 3D harmonic and thermal analysis of VHF-UHF resonators. We also show Coventor simulation data of our first two- and three-pole monolithic crystal filter designs as well as a filter array layout which facilitates integration with front-end RF electronics and switches. Finally, we demonstrate a mechanical tuning technique for our resonators utilizing focused-ion-beam (FIB) technology.
  • Keywords
    UHF filters; VHF filters; circuit tuning; crystal resonators; focused ion beam technology; harmonic analysis; micromechanical resonators; resonator filters; sensitivity; sputter etching; thermal analysis; wafer bonding; 3D harmonic analysis; FIB technology; III-V electronics; MEMS quartz resonator technology; Q-factor; UHF filters; UHF oscillators; VHF filters; VHF oscillators; dry plasma etching; filter array layout; focused-ion-beam technology; front-end RF electronics; high-Q oscillators; impedance; mechanical tuning technique; monolithic crystal filter designs; silicon electronics; temperature sensitivity; thermal analysis; wafer bonding; III-V semiconductor materials; Micromechanical devices; Oscillators; Plasma applications; Plasma materials processing; Plasma simulation; Plasma temperature; Resonator filters; Silicon; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium and Exposition, 2004. Proceedings of the 2004 IEEE International
  • ISSN
    1075-6787
  • Print_ISBN
    0-7803-8414-8
  • Type

    conf

  • DOI
    10.1109/FREQ.2004.1418425
  • Filename
    1418425