• DocumentCode
    2983335
  • Title

    A low power SOI adder using reduced-swing charge recycling circuits

  • Author

    Inoue, A. ; Dklobdzija, V.G. ; Walker, W.W. ; Kai, M. ; Izawa, T.

  • Author_Institution
    Fujitsu Labs. of America Inc., Sunnyvale, CA, USA
  • fYear
    2001
  • fDate
    7-7 Feb. 2001
  • Firstpage
    316
  • Lastpage
    317
  • Abstract
    Power reduction is a critical requirement in modern VLSI design due to increasing operating frequencies and circuit densities, and the emergence of portable applications. Decreasing the supply voltage, V/sub DD/, is the easiest way to reduce power consumption in CMOS circuits because switching power is proportional to V/sub DD//sup 2/ for rail-to-rail logic swing. However, reducing V/sub DD/ degrades circuit speed due to the super-linear reduction of transistor current. Lowering transistor threshold voltage, V/sub th/, helps to recover this speed degradation; however sub-threshold leakage current increases exponentially with decreasing V/sub th/, resulting in battery-draining quiescent power consumption with V/sub th/ less than about 300 mV. Circuit techniques are needed to achieve lower power consumption without speed degradation. The low-power CMOS SOI circuit configuration reported here, low-swing charge recycling (LSCR), uses differential pass-transistor logic, a low voltage swing, and charge recycling to save power.
  • Keywords
    CMOS logic circuits; adders; low-power electronics; silicon-on-insulator; VLSI design; differential pass-transistor logic; low-power CMOS SOI adder; low-swing charge recycling circuit; sub-threshold leakage current; transistor threshold voltage; Adders; CMOS logic circuits; Degradation; Energy consumption; Frequency; Leakage current; Recycling; Switching circuits; Threshold voltage; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-6608-5
  • Type

    conf

  • DOI
    10.1109/ISSCC.2001.912654
  • Filename
    912654