DocumentCode
2983681
Title
Mechanically-coupled micromechanical resonator arrays for improved phase noise
Author
Lee, Seungbae ; Nguyen, Clark T C
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
fYear
2004
fDate
23-27 Aug. 2004
Firstpage
144
Lastpage
150
Abstract
Reductions in phase noise by more than 26 dB have been obtained over previous micromechanical resonator oscillators by replacing the single resonator normally used in such oscillators with a mechanically coupled array of them to effectively raise the power handling ability of the frequency selective tank by a factor equal to the number of resonators used in the array, and all with virtually no increase in volume or cost, given that all resonators are integrated onto a single die using batch processed MEMS technology. Specifically, a mechanically coupled array of ten 15.4-MHz 40μm×10μm×2μm free-free beams embedded in a positive feedback loop with a single-ended to differential transimpedance sustaining amplifier achieves phase noise of -109 and -133 dBc/Hz at 1 kHz and far-from-carrier offset frequencies, respectively. When divided down to 10 MHz, these effectively correspond to -112 and -136 dBc/Hz, respectively, which represent more than 17 and 26 dB improvements over recently published work with clamped-clamped beam resonator oscillators.
Keywords
HF amplifiers; arrays; differential amplifiers; feedback; micromechanical resonators; phase noise; radiofrequency oscillators; 1 kHz; 10 MHz; 15.4 MHz; amplifier; batch processed MEMS technology; improved phase noise; mechanically coupled micromechanical resonator arrays; micromechanical resonator oscillators; positive feedback loop; single-ended to differential transimpedance; Differential amplifiers; Feedback loop; Frequency; GSM; Micromechanical devices; Oscillators; Phase noise; Phased arrays; Temperature dependence; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium and Exposition, 2004. Proceedings of the 2004 IEEE International
ISSN
1075-6787
Print_ISBN
0-7803-8414-8
Type
conf
DOI
10.1109/FREQ.2004.1418444
Filename
1418444
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