DocumentCode :
2983681
Title :
Mechanically-coupled micromechanical resonator arrays for improved phase noise
Author :
Lee, Seungbae ; Nguyen, Clark T C
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
144
Lastpage :
150
Abstract :
Reductions in phase noise by more than 26 dB have been obtained over previous micromechanical resonator oscillators by replacing the single resonator normally used in such oscillators with a mechanically coupled array of them to effectively raise the power handling ability of the frequency selective tank by a factor equal to the number of resonators used in the array, and all with virtually no increase in volume or cost, given that all resonators are integrated onto a single die using batch processed MEMS technology. Specifically, a mechanically coupled array of ten 15.4-MHz 40μm×10μm×2μm free-free beams embedded in a positive feedback loop with a single-ended to differential transimpedance sustaining amplifier achieves phase noise of -109 and -133 dBc/Hz at 1 kHz and far-from-carrier offset frequencies, respectively. When divided down to 10 MHz, these effectively correspond to -112 and -136 dBc/Hz, respectively, which represent more than 17 and 26 dB improvements over recently published work with clamped-clamped beam resonator oscillators.
Keywords :
HF amplifiers; arrays; differential amplifiers; feedback; micromechanical resonators; phase noise; radiofrequency oscillators; 1 kHz; 10 MHz; 15.4 MHz; amplifier; batch processed MEMS technology; improved phase noise; mechanically coupled micromechanical resonator arrays; micromechanical resonator oscillators; positive feedback loop; single-ended to differential transimpedance; Differential amplifiers; Feedback loop; Frequency; GSM; Micromechanical devices; Oscillators; Phase noise; Phased arrays; Temperature dependence; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium and Exposition, 2004. Proceedings of the 2004 IEEE International
ISSN :
1075-6787
Print_ISBN :
0-7803-8414-8
Type :
conf
DOI :
10.1109/FREQ.2004.1418444
Filename :
1418444
Link To Document :
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