DocumentCode :
2983926
Title :
A comparative study of SiN deposition methods for millimeter-wave AlGaN/GaN HFETs
Author :
Higashiwaki, Masataka ; Chen, Zhen ; Pei, Yi ; Chu, Rongming ; Keller, Stacia ; Hirose, Nobumitsu ; Mimura, Takashi ; Matsui, Toshiaki ; Mishra, Umesh K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA
fYear :
2008
fDate :
23-25 June 2008
Firstpage :
207
Lastpage :
208
Abstract :
This paper describes a comparative study on device characteristics of short-gate AlGaN/GaN HFETs with extremely thin SiN films deposited by different methods on the AlGaN surfaces. SiN deposition on an AlGaN surface greatly increases ns regardless of the deposition method, and it is useful to fabricate highly-scaled GaN HFETs for high-frequency applications. However, specific device characteristics are closely related to the deposition method; therefore, a proper choice of deposition method and further optimization of the deposition conditions are important for improvements in device characteristics. AlGaN/GaN heterostructure field-effect transistors (HFETs) are excellent candidates for millimeter-wave applications in the near future.
Keywords :
III-V semiconductors; MOCVD coatings; aluminium compounds; gallium compounds; millimetre wave field effect transistors; plasma CVD coatings; silicon compounds; wide band gap semiconductors; AlGaN; AlGaN-GaN-SiN; Cat-CVD; heterostructure field-effect transistor; high-scaled HFET fabrication; metalorganic chemical vapor deposition; millimeter-wave HFET device characteristics; plasma enhanced chemical vapor deposition; silicon nitride deposition method; Aluminum gallium nitride; Chemical vapor deposition; Cutoff frequency; Gallium nitride; HEMTs; MOCVD; MODFETs; Millimeter wave technology; Millimeter wave transistors; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2008
Conference_Location :
Santa Barbara, CA
ISSN :
1548-3770
Print_ISBN :
978-1-4244-1942-5
Electronic_ISBN :
1548-3770
Type :
conf
DOI :
10.1109/DRC.2008.4800805
Filename :
4800805
Link To Document :
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