Title :
A 113 mm/sup 2/ 600 Mb/s/pin 512 Mb DDR2 SDRAM with vertically-folded bitline architecture
Author :
Kirihata, T. ; Mueller, G. ; Clinton, M. ; Loeffler, S. ; Ji, B. ; Terletzki, H. ; Hanson, D. ; Chorng-Lil Hwang ; Lehmann, G. ; Storaska, D. ; Daniel, G. ; Hsu, L. ; Weinfurtner, O. ; Boehler, T. ; Schnell, J. ; Frankowsky, G. ; Netis, D. ; Ross, J. ; Re
Author_Institution :
Semicond. R&D Center, IBM Microelectron., Hopewell Junction, NY, USA
Abstract :
This 512 Mb DDR2 SDRAM is designed with the DDR2 features being standardized by JEDEC. The SDRAM uses a four-quadrant architecture, each 128 Mb quadrant containing 16 k rows x 8 k columns. A 6.6F/sup 2/ (2.2F×3F) deep trench cell with a vertical access gate is employed. The wordline pitch is increased by 10% and the bitline pitch by 50%, yet the cell area is reduced to as little as 82.5% that of the 8F/sup 2/ cell. Each 128 Mb quadrant is partitioned into sixteen 8 Mb blocks horizontally. It is also partitioned into sixteen 8 Mb segments vertically. These partitions configure a 512 kb array, each containing 1024 wordlines (WLs) and 512 bitlines (BLs). A total of 16×16 512 kb arrays are arranged in a matrix in each 128 Mb quadrant. A hierarchical row decoder block (HRDEC) drives a master wordline (MWL) on a 2nd level metal (M2). A local wordline decoder block (LRDEC) then redrives the MWL to control a local W-silicide wordline (LWL).
Keywords :
DRAM chips; memory architecture; 512 Mbit; 6.6F/sup 2/ deep trench cell; 600 Mbit/s; DDR2 SDRAM; JEDEC standardization; bitline pitch; dynamic RAM; four-quadrant architecture; hierarchical row decoder block; local W-silicide wordline; local wordline decoder block; synchronous DRAM; vertical access gate; vertically-folded bitline architecture; wordline pitch; Clocks; Content addressable storage; Decoding; Delay; Logic; Microelectronics; Noise cancellation; Research and development; SDRAM; Topology;
Conference_Titel :
Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-6608-5
DOI :
10.1109/ISSCC.2001.912683