DocumentCode
2984016
Title
High pin count BGA board level assembly
Author
Mendez, David M.
Author_Institution
Solectron Texas, Austin, TX, USA
fYear
1997
fDate
13-15 Oct 1997
Firstpage
452
Lastpage
456
Abstract
Successful processing of high pin count Ball Grid Array (BGA) components through an assembly operation is dependant upon many factors including solder paste deposition, component placement, and quality of the raw materials including the printed wiring boards (PWB) and the BGA components
Keywords
assembling; integrated circuit packaging; printed circuit manufacture; soldering; surface mount technology; BGA board level assembly; assembly operation; component placement; pin count; printed wiring boards; raw material quality; solder paste deposition; Assembly; Bridges; Coordinate measuring machines; Electronics packaging; Inspection; Lead; Printers; Printing; Robustness; X-ray lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location
Austin, TX
ISSN
1089-8190
Print_ISBN
0-7803-3929-0
Type
conf
DOI
10.1109/IEMT.1997.626962
Filename
626962
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