DocumentCode :
2984426
Title :
Packaging of surface acoustic wave (SAW) based biosensors: an important issue for future biomedical applications
Author :
Länge, Kerstin ; Blaess, Guido ; Volgt, A. ; Rapp, Michael ; Hansjosten, Edgar ; Schygulla, Ulrich
Author_Institution :
Inst. of Instrum. Anal., Forschungszentrum Karlsruhe, Germany
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
321
Lastpage :
325
Abstract :
SAW devices, based on horizontally polarized surface shear waves (HPSSW) enable label-free, sensitive and cost-effective detection of biomolecules in real time. Early results have shown the importance of small sampling volumes with low inner surface areas as well as minimal mechanical stress arising from scaling elements of miniaturized sampling chambers. In this paper, we present a new way to integrate SAW devices with the sampling chamber: the sensor device is completely packed within a polymeric housing produced by stereo lithographic methods. The resulting polymer chip serves as a tight, durable but still disposable package for HPSSW biosensors which are completely encapsulated within the polymer chip. It includes a small sampling channel with a sample volume of only 374 nl per chip. Several preliminary experiments with these chips are shown to characterize the performance for their future application as a generic bioanalytical micro device.
Keywords :
biosensors; encapsulation; microfluidics; microsensors; plastic packaging; stereolithography; surface acoustic wave sensors; SAW biosensor packaging; bioanalytical microdevices; biomolecule detection; disposable sensor; encapsulated HPSSW biosensors; horizontally polarized surface shear waves; polymeric housing; sampling chambers; sampling channel; small sampling volume devices; stereo lithography; Acoustic signal detection; Acoustic waves; Biosensors; Molecular biophysics; Packaging; Polarization; Polymers; Sampling methods; Surface acoustic wave devices; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium and Exposition, 2004. Proceedings of the 2004 IEEE International
ISSN :
1075-6787
Print_ISBN :
0-7803-8414-8
Type :
conf
DOI :
10.1109/FREQ.2004.1418473
Filename :
1418473
Link To Document :
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