• DocumentCode
    2984726
  • Title

    Characterization of the static and dynamic behavior of a SiC BJT

  • Author

    Ahmed, M.M.R. ; Parker-Allotey, N.-A. ; Mawby, P.A. ; Nawaz, Muhammed ; Zaring, Carina

  • Author_Institution
    Electr. & Electron., Warwick Univ., Coventry
  • fYear
    2008
  • fDate
    1-3 Sept. 2008
  • Firstpage
    2472
  • Lastpage
    2477
  • Abstract
    Silicon carbide (SiC) bipolar junction transistors (BJTs) are interesting candidates for high temperature and for high power applications primarily due to their low conduction losses and fast switching capability. The aim of this paper is to test and evaluate both the static and dynamic characteristics of SiC bipolar junction transistor (developed by TranSiC) rated at 600 V and 6 A at different temperatures. The high power curve tracer 371B has been used to test the DC output characteristics of the device in a temperature range of - 40degC to 175degC. A single pulse switching inductive load circuit has been used to test the dynamic characteristics of the SiC BJT. The experimental results with a normal gate drive circuit, show that the device has a turn on time of less than 0.5 mus and turn off time of less than 0.35 mus under test condition of 300 V, 10 A in an ambient temperature of range - 40degC to 125degC. In addition, the experimental data were analyzed to obtain the device performance parameters like the turn on, off time, transistor gain and switching losses.
  • Keywords
    bipolar transistors; SiC BJT; TranSiC; dynamic behavior; silicon carbide bipolar junction transistors; static behavior; Circuit testing; Data analysis; Performance analysis; Performance gain; Performance loss; Pulse circuits; Silicon carbide; Switching circuits; Switching loss; Temperature distribution; Bipolar Junction Transistor (BJT); Characterization; Power electronics; Silicon Carbide (SiC);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Motion Control Conference, 2008. EPE-PEMC 2008. 13th
  • Conference_Location
    Poznan
  • Print_ISBN
    978-1-4244-1741-4
  • Electronic_ISBN
    978-1-4244-1742-1
  • Type

    conf

  • DOI
    10.1109/EPEPEMC.2008.4635634
  • Filename
    4635634