DocumentCode :
2984734
Title :
Degradation Mechanisms in SiC Bipolar Junction Transistors
Author :
Qingchun Zhang ; Jonas, C. ; Agarwal, A. ; Muzykov, P. ; Sudarshan, T. ; Geil, B. ; Scozzie, C.
Author_Institution :
Cree Inc., Research Triangle Park, NC
fYear :
2008
fDate :
23-25 June 2008
Firstpage :
285
Lastpage :
286
Abstract :
SiC power bipolar junction transistors (BJTs) are believed to have the potential of operating reliably at much higher junction temperatures as compared to SiC MOSFETs. The obstacle for commercialization of SiC BJTs is the presence of degradation in both on-resistance and current gain, first detected by Agarwal et al. The recombination-induced stacking faults (SFs) were a prime suspect but no clear experimental proof was provided. In this paper, for the first time, we provide an experimental evidence of the recombination- induced SFs in SiC BJTs, and correlation with device characteristics.
Keywords :
power bipolar transistors; silicon compounds; wide band gap semiconductors; SiC; SiC power bipolar junction transistors; degradation mechanisms; recombination-induced stacking faults; Conductivity; Degradation; MOSFETs; Milling machines; Powders; Silicon carbide; Spontaneous emission; Stacking; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2008
Conference_Location :
Santa Barbara, CA
ISSN :
1548-3770
Print_ISBN :
978-1-4244-1942-5
Type :
conf
DOI :
10.1109/DRC.2008.4800841
Filename :
4800841
Link To Document :
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