• DocumentCode
    2984742
  • Title

    A Low Offset High Voltage Swing Rail-to-Rail Buffer Amplifier with for LCD Driver

  • Author

    Hong, Guo-Teng ; Shen, Chih-Hsiung

  • Author_Institution
    Nat. Changhua Univ. of Educ., Changhua
  • fYear
    2007
  • fDate
    20-22 Dec. 2007
  • Firstpage
    1025
  • Lastpage
    1030
  • Abstract
    This paper presents a design and implementation of an output buffer for LCD Driver with rail-to-rail voltage swing using TSMC 0.35 mum 2P4M process at 5 V supply. We designed a class-B output buffer with offset compensation ability to reduce the nonlinearity of output voltage. It performs a rail-to-rail swing range and high slew rate of 14 V / mus and 11.5 V / mus for rising and falling edges under a 400 pF capacitance load. For high driving capability , two push-pull output stages are used . two frequency compensation stages are also introduced for stability , One is the miller compensation with 0.04 pF capacitance , and the other is zero compensation with 0.1 kOmega added between two push-pull output stages for stable driving under different capacitance loads. The result exhibits the settling times of 0.7 mus for rising and 0.85 mus for falling edges with voltage swing 5 V under a 400 pF capacitance load. Even under a 1000 pF capacitance load , it still has the settling time of 1.52 mus and 1.80 mus for rising and falling edges , respectively. The effective area of this buffer is only 100 x 100 mum2 with build-in offset voltage holding capacitor.
  • Keywords
    amplifiers; buffer circuits; capacitance; driver circuits; liquid crystal displays; LCD driver; TSMC 2P4M process; buffer amplifier; capacitor; frequency compensation; rail-to-rail voltage swing; size 0.353 mum; Capacitance; Computer displays; Digital circuits; Driver circuits; Liquid crystal displays; Low voltage; Rail to rail amplifiers; Rail to rail outputs; Stability; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2007. EDSSC 2007. IEEE Conference on
  • Conference_Location
    Tainan
  • Print_ISBN
    978-1-4244-0637-1
  • Electronic_ISBN
    978-1-4244-0637-1
  • Type

    conf

  • DOI
    10.1109/EDSSC.2007.4450302
  • Filename
    4450302