DocumentCode :
2985019
Title :
Benchmarking reliability tests for plastic laminate modules
Author :
Roesch, William J. ; Byrd, Dee H.
Author_Institution :
TriQuint Semicond. Inc., Hillsboro, OR, USA
fYear :
2002
fDate :
20 Oct. 2002
Firstpage :
69
Lastpage :
77
Abstract :
The high volume commercial application for compound semiconductors (at the moment) is cellular phones. Several hundred million wireless phones are being manufactured every year with radios enabled by compound semiconductor amplifiers, receivers, and switches. Recently, portions of these radios have been simplified and compressed into "modules." This packaging transformation may have special reliability concerns that are the subject of this work. An investigation was made into the reliability aspects of modules. Customer requirements were collected and leading suppliers were interviewed for their insight.
Keywords :
laminates; modules; plastic packaging; reliability; testing; plastic laminate modules; reliability test benchmarking; Assembly; Benchmark testing; Cellular phones; Inductors; Laminates; Manufacturing; Plastics; Substrates; Transmission line matrix methods; X-rays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
GaAs Reliability Workshop, 2002
Print_ISBN :
0-7908-0103-5
Type :
conf
DOI :
10.1109/GAAS.2002.1167867
Filename :
1167867
Link To Document :
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